Photomasking and etching.
(6) Completed IC. The preceding steps have changed a silicon chip into an
IC. During the process, diodes, transistors, resistors, and capacitors
may be formed in the same IC. To complete the IC, further oxidation,
masking, etching, and diffusion connect the components. This is shown
in figure 3-7.
is made by depositing extremely thin films of metals and insulators on a glass or
ceramic substrate. The substrate in this case merely serves as a platform for the
circuit as opposed to the monolithic IC, in which the substrate is a part of the