(1)
Removal and replacement of sockets for IC and transistorized components
require similar desoldering techniques as mentioned above, only greater care is to be taken to
prevent damage to fragile conductive material.
CAUTION
MANY NEW COMPONENTS AND COMPONENT ASSEMBLIES
ARE HIGHLY SENSITIVE TO STATIC VOLTAGES.
(2)
Care should be taken in the removal and replacement of nonsocketed ICs and
transistorized components. Assemblies using CMOS devices should be installed using
appropriate static discharge preventive measures. Currently, the components used in the C-
6533 are not fabricated using these sensitive components.
(3)
Replacement of component connectors, multipinned connector assemblies, and
cannon plugs require use of special handtools. These special handtools should be available in
your shop's general purpose maintenance kit MK-693/A.
(4)
Make sure to tag all wires when replacing connector and plug assemblies. This
practice will be especially helpful when wiring diagrams and color codes are not available.
(5)
Wire bundle repair such as splices should be avoided if at all possible. The
most effective repair of an open or heat damaged wire would be to replace the complete
conductor with the same gauge wire.
3.
Replacement of component assemblies will be according to standard shop practice and
procedures. Care should be taken to avoid damaging the new replacement component
assembly. Use appropriate tools for component installation.
4.
After replacing the faulty part/component assembly, make a good visual inspection of
the component card assembly and/or any related wires or switches.
a.
Check for clean, neat solder connections.
b.
Check for loose, broken, or frayed wires.
c.
Check for bent or crimped pins on connectors and jacks.
d.
Check for loose or misplaced screws, washers, or excess solder.
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