5. During the forming of a monolithic IC, after the epitaxial growth is
completed the epitaxial layer is given a protective coating.
This coating is
applied by a process known as
a.
etching.
c.
diffusion.
b.
oxidation.
d.
photomasking.
6. The desired circuit design is applied to a monolithic IC by using a
photomask and exposing the chip to
a.
ultraviolet light.
c.
sunlight.
b.
infrared rays.
d.
X-rays.
7. One step in making a monolithic IC is to wash the chip with a photo
developing fluid. The purpose of washing the chip is to
a.
prepare the chip for exposure to the ultraviolet light.
b.
develop the picture of the circuit on the epitaxial layer.
c.
dissolve the photoresist that was protected by the photomask.
d.
dissolve the photoresist that was not protected by the photomask.
8. In the forming of a monolithic IC, the diffusion process must be rigidly
controlled so that it can be stopped when the impurity atoms reach the
a.
epitaxial layer.
c.
substrate.
b.
photoresist.
d.
dopant.
9.
One difference between the thin film IC and the monolithic IC is that
a.
transistors are not formed as part of the thin film IC.
b.
the monolithic IC has components with closer tolerances.
c.
the thin film IC is preferred for low-frequency circuits.
d.
the substrate serves only as a platform for the monolithic IC.
10. A comparison of digital and linear IC's shows that both
a.
are custom made.
b.
have low power requirements.
c.
operate with very loose tolerances.
d.
perform switching functions in digital circuits.
309 L3
53
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