Figure 3-5.
Photomasking and etching.
Figure 3-6.
Isolation diffusion.
(6) Completed IC. The preceding steps have changed a silicon chip into an
IC. During the process, diodes, transistors, resistors, and capacitors
may be formed in the same IC. To complete the IC, further oxidation,
masking, etching, and diffusion connect the components. This is shown
in figure 3-7.
b. Thin Film IC. Another type of integrated circuit is the thin film IC. It
is made by depositing extremely thin films of metals and insulators on a glass or
ceramic substrate. The substrate in this case merely serves as a platform for the
circuit as opposed to the monolithic IC, in which the substrate is a part of the
circuit.
309 L3
43
Previous Page
